Intel Haswell Microarchitecture Survey

Intel Haswell Give AwayTake a 3-Minute Survey for a Chance to Win a Dell Venue 2-in-1

Are you considering the new Intel E5-2600 v3 series of Xeon microprocessors for your next application platform? How will this technology impact your application and platform performance?

We value your opinion and would like to hear your thoughts. We invite you to participate in a nine-question survey to gain a better understanding of the market’s needs around transitioning to Intel’s next-generation Xeon (a.k.a. Haswell) processors. Those who complete the survey will be entered into a drawing for a Dell Venue 11 Pro. The 10.8″ Dell Venue Pro combines the portability of a tablet, the power of an Ultrabook and the experience of a desktop.

As a leader in application deployment, our goal is to create the easiest transition path for those looking to leverage cutting-edge technology to gain a competitive advantage. Your feedback will help us to develop additional resources and services to ease transition challenges and address market needs. The cumulative results of the survey will be published on the UNICOM Engineering website and via a future blog post.

Start the Survey Now!

Keeping Pace with Intel’s High Performance Focus

Intel’s methodical approach to process technology advancement and enhancement of its CPU microarchitecture give OEMs a predictable model through which they can plan product roadmaps that include performance increases and cost reductions.

BY AUSTIN HIPES, UNICOM ENGINEERING

Overview of Intel Xeon Processor E5-2600 v3 product family (Haswell). Courtesy Intel.
Overview of Intel Xeon Processor E5-2600 v3 product family (Haswell). Courtesy Intel.

Last year, Intel introduced its next-generation microarchitecture codenamed Haswell. While the 1st rollout of this new microarchitecture focused on desktop and notebook platforms, Intel has just recently released new Haswell CPUs specifically designed to address the dual processor server market. This new roll-out of Haswell-based CPUs, the Intel Xeon E5-2600 V3 processors, illustrate Intel’s commitment to pushing performance standards higher and in turn, elevating the level at which its OEM partners must perform (Figure 1).

Of course, marching in lock-step with Intel inevitably pays dividends for its partners as well as the customer base. In other words, it’s safe to assume with many new product launches that performance will increase handily, while the pricing of the upgraded architecture actually becomes more favorable for consumers, offering better performance at the same price point of their previous upgrades.

Key to this formula is Intel’s unique “Tick-Tock” model, which delivers continued innovations in manufacturing process technology and processor microarchitecture in alternating “tick” and “tock” cycles. A “tick” cycle advances manufacturing process technologies to enable new capabilities such as higher performance and greater energy efficiency within a smaller, more capable version of the previous “tock” microarchitecture. The alternating “tock” cycle uses the previous “tick” cycle’s manufacturing process technologies to introduce new innovations in processor microarchitecture to improve energy efficiency and performance, as well as functionality and density of features (Figure 2).

Intel’s “tick-tock” model alternates between improvements to manufacturing/process technology and enhancements in processor microarchitecture. Courtesy Intel.
Intel’s “tick-tock” model alternates between improvements to manufacturing/process technology and enhancements in processor microarchitecture. Courtesy Intel.

While this provides a roadmap for increased performance, it also helps Intel partners maintain some predictability in their own product cycles as they strive to embed technologies that match the performance standards of Intel’s latest product launch.

More Performance and Better Value

So, what does this mean for customers and the OEMs that support them? To better understand the translation, let’s consider the latest Intel microarchitecture release codenamed Haswell. The E5 2600 V3 processors featured as part of this release offer up to 18 physical cores per CPU. Along with more cores come faster memory and a faster interconnect between the CPUs in the system. This provides substantially more compute power, which will enable 40 GbE to be a practical reality in standard server platforms. This is a tremendous benefit when you consider growing trends like the “Internet of Things” that continually increases network throughput. With more traffic and more systems to process, 40GbE provides the ability to add more capability to systems – rather than adding more servers – to handle this increase in traffic.

E5-2600 V3-based servers also bring a needed increase in performance in non-volatile storage technology with native support for DDR4 NVDIMMs. DDR4 NVDIMMs provide an industry-standard way of storing data in high-speed RAM without the fear of losing the data in the event of a power or node failure. In addition to DDR4 NVDIMM support in new E5-2600 V3-based dual processor server platforms, the performance of SSDs is increasing with the addition of NVMe support, giving multi-lane PCIe access directly to SSD storage. This results in lower latency and provides more bandwidth to a solid state drive than SATA or SAS would, in effect creating multiple tiers of high performance storage depending on what each unique system actually requires. Unlike some previous generations of PCIe SSD storage, NVMe SSDs are offered in hot-swap 2.5” hard drive form factors, as well as traditional PCIe add-in Cards (AICs). In this new 2.5” form factor, OEMs are able to take advantage of the newer, high performance SSD architecture while maintaining high levels of serviceability and drive density typically associated with SAS and SATA drive types.

For customers seeking higher performance, the cost typically becomes more expensive per gigabyte. A logical approach to managing these costs is via a tiered storage model that keeps the most frequently accessed data on the most expensive tier, where fast access is possible, and moves less sensitive data to outer tiers which have reduced performance but lower costs per gigabyte. While the value component improves with each subsequent release, so does the process behind which those upgrades are delivered. By providing customers with the next generation of Intel processors and ensuring the corresponding system upgrades incorporate the latest microarchitecture, Intel delivers a balanced platform that prevents choke points from developing.

Creating New Levels of Efficiency

As new technologies emerge, along with the new microarchitecture, it helps design partners like Unicom Engineering plan the customers’ next transition for increased performance at near the same price, or substantially increased performance over their previous generation of products to keep their solution on the cutting edge .The corollary to this is if customers do not require increased performance, then it is possible to scale them into a lower tier system so there is the potential of paying less for the same performance level they are accustomed to.

In looking at three rapidly-growing markets – storage, information security and communications – each require more capacity and all industries expect to acquire it at a decreasing cost per session, gigabyte of storage, and gigabit of throughput. Having more cores and bandwidth available in a system means each node can have more throughput as a whole, allowing a storage appliance, for example, to handle more directly connected bulk storage.. More CPU cores, more network bandwidth, and more memory bandwidth means customers can go to a higher sequence of either encryption or security transactions. Simply put, each system can perform more work or handle more bandwidth.

Looking specifically at the communications infrastructure, Intel’s customers can do more transcoding, more encryption, and more ostentations with the new Haswell microarchitecture in a single box than they’ve ever done before. They can handle more subscribers, or the same number of subscribers at a higher workload than possible under the previous platform. For roughly the same power, price and physical footprint, they can handle more transactions.

Intel’s Commitment to Partners Runs Deep

Not only is there the ability to choose between greater power and performance, but also the ability to match price points to specific performance needs. For example, if a customer was seeking a brand new architecture, OEMs can recommend they hold off for the appropriate number of months until they can get Intel’s latest and greatest. Plus, as the actual product release draws near, Intel begins to feed more details into the marketplace: 18-24 months out, the projected timing of the new technology cut-in date is known; one year out, it becomes clearer; 6 months usually signals final feature decisions and 3 months until launch, everything is locked down. Thirty days prior to the product launch, all pre-production equipment has been evaluated. By maintaining this consistency in upgrade deployments, Intel OEM partners can better advise customers on what technology investments to make and when.

Intel’s Embedded Alliance is another innovation the company provides to OEM partners in order to maximize the potential of new upgrades and releases. Affording its partners access to all of the products on the Intel Embedded roadmap lets OEMs know that Intel will guarantee availability of those products for at least seven years after product launch. Some customers want an architecture that will be stable for a long time, enabling OEMs to leverage their relationship with Intel to help customers choose products that are going to be available for multiple years. This drives stronger relationships across the distribution chain, and builds trust in Intel’s solutions, even as they continue to drive new levels of architecture performance.

The Haswell E5-2600 V3 CPUs are built on the same Intel 22nm tri-gate transistor technology process as the previous release of E5-2600 V2 Ivy Bridge processors, so the manufacturing process maturity enables the release of new features on a stable platform. Intel makes this possible by adhering to a very predictable schedule that sees the release of the next CPU every 18-24 months. Additionally, the majority of the time that there is a new “Tick” process die shrink, the new model CPUs are able to be installed into the same physical platform as the “Tock” microarchitecture that proceeded them. The motherboards that take V3 CPUs are expected to take future generation “V4 CPUs” with little or no platform modifications required (Figure 3). So, now is the time for OEMs to begin working with customers to evaluate the new architecture that is going to handle two generations of CPUs and is going to be the primary platform architecture for the next 3.5 to 4 years. This is a busy time for OEMs as they simultaneously work with the existing Intel platforms while being cognizant of the soon-to-be-changing microarchitecture.

Example of advanced motherboard with V3 CPU and the ability to readily accept the next generation V4. Courtesy Intel.
Example of advanced motherboard with V3 CPU and the ability to readily accept the next generation V4. Courtesy Intel.

In many ways, customers and OEM partners move with Intel on a rapidly shifting paradigm. But Intel’s focus on maintaining productive relationships with all members of its deployment chain ensures its performance is always an asset and not a hindrance to supporting evolving requirements for increased productivity at a lower cost threshold.

UNICOM Engineering
Canton,MA.
(781) 332-1000
www.unicomengineering.com

Intel’s 2014 Developer Forum | UNICOM Engineering

Internet of Things Word CloudThe Internet of Things (IoT) brings an entirely new dimension to computing and the Internet. IoT provided the theme for Intel’s annual Developers Forum (IDF) this fall in San Francisco. As a solutions leader utilizing Intel products, UNICOM Engineering participates in IDF to keep our clients on the cutting-edge of technological innovation.

The Internet of Things imagines a fully connected world of devices not normally thought of as computers. This world is already coming into being through smartphones and now smartcars capable of communicating maintenance needs with wireless connections. But, this is just the beginning.

Shoes, fitness devices, weather sensors, thermostats, intelligent appliances and other devices still to be imagined will provide a level of interconnectedness seldom dreamed of even in science fiction. UNICOM Engineering looks forward to the challenge of helping our clients develop IoT solutions to meet their business models. IoT devices will allow the collection of data on a micro level, which can then be processed to provide a macro picture. By communicating with cloud services, IoT devices identify trends and allow social connections.

IDF presented more than just the Internet of Things. Intel’s new CPU series, the E5-2600 v3, codenamed Haswell, was introduced as the new Enterprise CPUs. This new series continues the trend of pushing compute and IO up to higher performance levels. CPUs containing up to 18 cores and the addition of DDR4 memory support combine to offer performance levels up to 50% over the previous Sandy Bridge generation.

UNICOM Engineering uses the information gained at events like IDF to assist our clients in transition plans to Intel Xeon Processor E5-2600 v3 family of high performance computing, communication platforms and security appliances. UNICOM Engineering offers the earliest access to test and evaluation platforms, extensive experience and field engineering expertise, ecosystem knowledge and a platform agnostic approach to designing the best deployment platform for your application. Call 800-977-1010 or visit www.unicomengineering.com to get started today.

COMING TOGETHER TO GIVE BACK – The UNICOM Engineering Golf Classic

Golf Event 2014 Golf Event_2 2014

UNICOM Engineering had the unique privilege of spending an afternoon with our closest technology partners, colleagues and customers to network and give back to the community. The annual UNICOM Engineering Golf Classic was held October 7 at The Tribute Golf Course in The Colony. Due to the generosity of our sponsors, our annual networking event was able to raise awareness and over $18,000 to support a few of our favorite charities.

An afternoon of golf intended to thank our partners for their continued support and unrelenting efforts on behalf of our customers became something more. We connected on a very human level and were reminded why we were there thanks to three very charismatic and passionate speakers. By the end of the evening, representatives from the Children’s Advocacy Center of Collin County, the Will to Live Foundation and Allies in Service had everyone applauding, doing a pushup challenge, sharing a hug and walking away with the desire to give back. Here is a snapshot of what they shared:

Kate Goble from the Children’s Advocacy Center of Collin County shared a mission of hope and healing for children in need due to abuse and neglect. Their approach to safety, healing and justice brings together all of the necessary agencies in one building—minimizing the burden on the child to share their story and start again. The Children’s Advocacy Center of Collin County opened its doors in 1992 and since then has served more than 50,000 abused and neglected children.

John Trautwein, founder of the Will to Live Foundation, shared his very personal story of loss and hope. Following the tragic death of his 15 year old son to suicide, he found himself surrounded by a network of “teammates” that were part of every major up and down in life. Through this realization, he created a foundation that would work with teens to prevent teen suicide by bringing that same level of awareness of their network of teammates that already exists. Through events, sports teams, etc., they share their mission of hope, love and the will to live.

David Whitley from Allies in Service shared their mission to provide jobs, healthcare, education and appropriate housing to our veterans returning from service. He spoke of men and women that have given of their time and lives but yet often struggle to transition back into civilian life. Allies in Service provides mentorship programs and business outreach to help veterans reach their full potential and improve their quality of life. Why is hiring a veteran good business? Veterans have the training, work ethic, and skill your organization depends on—learn more.

UNICOM Engineering was proud to organize the annual Golf Classic and appreciate everyone that was able to attend and support our event.

Choosing the Right Appliance Partner for Lifecycle Management

Lifecycle ManagementIndependent Software Vendors (ISVs) increasingly turn to appliance platforms to deliver their software applications and streamline lifecycle management. Appliances allow installation of software at a client’s site without utilization of client hardware, thereby avoiding compatibility issues. These pre-integrated, purpose-built, plug-and-play servers include the hardware, application software, operating system and any specialty components needed to deliver applications providing a standalone device for ISV’s to offer end users.

The advantages of the appliance model to product lifecycle management are obvious. The challenge for ISVs comes in finding a partner with the engineering expertise and production capabilities to manufacture and maintain appliance servers throughout an application’s lifecycle. Since designing, integrating  and deploying an appliance is not an ISV’s core business, vendors need to find a partner who specializes in the development of appliances. Here are three critical factors to consider:

1. Engineering Control and Manufacturing Quality – ISVs should seek partners with a highly proven record for solution design, systems integration, application management, global logistics, tech support, and maintenance programs. Such partners will execute best-practice processes in these key aspects of developing, manufacturing and servicing appliance platform solutions, integrating all aspects of lifecycle management for the appliance and application. The advantage to the ISV comes from the engineering controls and manufacturing quality that such focused partners offer.

A partner should handle regulatory and certification requirements, branding, packaging and international shipping for import and export. A global supply chain, product testing and evaluation, and software imaging should be available for application lifecycle management. The partner must possess the capability to interact and report to multiple levels of the ISV’s organization, including engineering, operations, product management, and supply managers so the appliance can be optimized, delivered and maintained for long-life operation.

2. Logistics, Tech Support and Training – ISVs must stay focused on client satisfaction and brand loyalty to survive in today’s globally competitive marketplace. Focusing solely on a manufacturing partner loses sight of the logistics and support services necessary for effective lifecycle management.  For the appliance model to succeed, it must maintain a robust forward- and reverse-logistics program and support organization to service end users in a timely manner. ISVs need to choose a partner with best-in-class logistics and support models capable of delivering reliably, and support staff to give clients confidence to keep buying.

3. Program Management – Success depends on the product management capabilities of the partner chosen by an ISV.  An appliance provider should assign a dedicated, professional account manager to lead a proactive account team to manage your program. An effective partner anticipates needs and looks to avoid problems rather than waiting for the ISV to identify them. The team should be experienced enough to identify and address technical and business issues before they become problematic. The partner should hold program managers accountable for the achievements of their clients.

UNICOM Engineering provides the kind of partner ISVs are looking for to develop appliance hardware solution to ease lifecycle management.

Learn More
Download our free white paper to learn how to deliver software as a purpose-built appliance at http://unicomengineering.com/how-deliver-software-purpose-built-appliance-wp. You can also contact UNICOM Engineering at www.unicomengineering.com or 800-977-1010.

UNICOM Engineering will also be at ASIS 2014 from September 29th – October 3rd. To set up a meeting with UNICOM at ASIS 2014visit http://www.unicomengineering.com/asis-2014.

UNICOM Engineering Aids Bandura®, a TechGuard Security® Company with International Rollout

UNICOM Engineering Aids TechGuard Security International RolloutTechGuard Security has protected U.S. government, financial and healthcare institutions for over a decade with its security solutions. Looking to take its flagship PoliWall® appliance into international markets, TechGuard Security needed a global technology partner that could help it manufacture and certify a new appliance for overseas markets.

PoliWall plays a vital role in the information systems security of critical networks. The appliance sits between firewalls and edge routers to stop threats at the network edge by blocking malicious traffic. Finding a reliable partner capable of developing the hardware platform suitable for international export was crucial to success.

TechGuard Security had worked with NEI, the company now known as UNICOM Engineering, and knew it could deliver. In addition to marketing the PoliWall internationally, TechGuard Security wanted to develop the next generation of the PoliWall appliance for both domestic and international markets.

They wanted to build a faster appliance with higher throughput, greater availability and a smaller footprint size. TechGuard Security knew that UNICOM Engineering’s proven experience with appliance manufacturing and expertise in international regulation certification could help them deliver a reliable solution to the global market quickly.

UNICOM Engineering takes a comprehensive approach to solution design and application deployment, utilizing standard technologies to build appliances that meet specific application requirements, accelerate time to market, and reduce total cost of ownership. Throughout the design process, the company considers all aspects of the solution lifecycle, including component life, energy efficiency and regulatory requirements.

“UNICOM Engineering had the platforms we needed to be able to support our new high-throughput product up to 20G per second,” said David Maestas, chief technology officer at Bandura, the company TechGuard Security created to market its IT security service. “The fact that the platforms were already pre-certified for export and for sale in the U.S. was a huge bonus for us.”

UNICOM Engineering has the capability to meet the demanding criteria of leading IT security companies like TechGuard Security in producing appliances for both domestic and international markets. To find out what UNICOM can do for you, visit our website at www.unicomengineering.com.

Read the full success story here.

Ready to deploy on an appliance? Looking to expand globally?

If you are looking for a design, integration and services partner to get your application to market, across the globe, contact UNICOM Engineering at 800-977-1010 or sales@unicomengineering.com.

UNICOM Engineering will also be at ASIS 2014 from September 29th – October 3rd. To set up a meeting with UNICOM at ASIS 2014visit http://www.unicomengineering.com/asis-2014.

Global Support Services Enhance Client Competitiveness

Global Support ServicesUNICOM Engineering provides global support services that enhance clients’ competitiveness. Just recently we expanded support for our stocking capabilities, which not only enables multinational return merchandise authorization (RM), but also gives clients the capability to streamline the repair and replacement of products globally. From the most challenging locations to the most heavily regulated BRIC countries, virtually the entire globe is within our reach—and our clients’ reach as well. This includes nations such as Russia, China, India, and Brazil.

Providing global IT services means our clients need access to parts worldwide. UNICOM Engineering maintains 25 stocking locations in North America, Asia Pacific, and Europe, and has access to more than 700 others as part of our Global Support Services network. This network gives our clients and us the ability to stock and ship mission-critical service parts and fully integrated solutions. UNICOM Engineering and our clients can quickly deliver replacement products worldwide within a four-hour or next-business-day delivery time. Our clients receive a fully integrated program with real-time inventory visibility and the response and repair bandwidth to offer competitive Service Level Agreements (SLAs) no matter how far they extend.

The unbounded growth potential of the global marketplace comes at the price of a dynamic regulatory environment and increased complexity. Knowledgeable and certified staff work on your behalf as Importer of Record (IOR)/Exporter of Record (EOR) in country, an essential element of our global support services. Otherwise, supporting mission-critical applications with completely integrated systems spare parts is time-consuming and difficult. UNICOM Engineering’s worldwide support stocking capabilities remove the risk and burden of technical support services from our clients, empowering them to remain competitive while successfully managing uptime.

UNICOM Engineering is a leading provider of deployment solutions, application platforms and lifecycle support services for OEMS and software technology developers worldwide. If you are in need of a partner that can build, ship and support your solutions on a global scale, contact UNICOM Engineering at www.unicomengineering.com or 800-977-1010.

UNICOM Engineering will also be at ASIS 2014 from September 29th – October 3rd. To set up a meeting with UNICOM at ASIS 2014visit http://www.unicomengineering.com/asis-2014.

EU Sanction on Dual Use Parts to Russia

EU Sanction on Dual Use Parts to RussiaGiven the current political climate, dual use parts are the subject of new EU sanctions. The reason for the sanctions is simple: dual use parts, while normally used for civilian purposes, can also have military applications and can be used in the proliferation of weapons of mass destruction. Because of the current situation in Russia, the EU has placed a ban on exporting military equipment to Russia, and this includes dual use parts.

If you trade in the global marketplace, it’s important to be sure that your shipments are in compliance. Because breach of sanctions is a criminal offense, we wanted to create awareness of this issue before any problems arise. In terms of the products and services that UNICOM Engineering deals with specifically, we believe that our customers should remain unaffected.  What the sanctions are specifically saying is this:

–          Dual use items to military end users in Russia are prohibited.

–          In addition, spare parts for military use items or military end users are prohibited.

–          Dual use as defined by the EU in Annex 1 of EC regulation Number 428/2009 states that “This prohibition should not affect the exports of dual-use goods and technology, destined/designated for non-military use or for a non-military end-user.

In the interest of export compliance, it is strongly suggested that shipments of dual use and non-dual use items be separated.  As other countries strive for trade compliance, delays in the shipment of dual use parts should be expected. For example, Dutch Customs has announced that all requests for export document approval for shipments containing dual parts will be held. These requests will be forwarded to the Central Service of Import and Export in the Netherlands, and that organization will determine on a case-by-case basis whether or not to issue export documents. As you can imagine, this will result in delays.

These measures taken by the EU are at the forefront of international efforts toward non-proliferation and must adjust as security risks and threats evolve. Regularly holding public consultations and maintaining constant dialogue with industry associations as well as academia and civil society, the European Commission strives to strike a balance between security and competitiveness. You can read the EU’s press release regarding these sanctions here.

UNICOM Engineering will continue to ensure compliance of sanctions and will inform clients of any delays caused by this issue. For a complete list of dual use parts, click here.

Our Global Logistics Services team is fully versed in global trade regulations, and we’re ready to help clients in every way possible. To learn more about UNICOM Engineering’s Trade Compliance capabilities visit our website and connect with us on LinkedIn, Facebook, and Twitter.

UNICOM Engineering will also be at ASIS 2014 from September 29th – October 3rd. To set up a meeting with UNICOM at ASIS 2014visit http://www.unicomengineering.com/asis-2014.

UNICOM Engineering Expands Canton Manufacturing Facility

UNICOM Engineering is proud to be a growing company. And with the growth of our business, we needed to expand our facilities. Earlier this year, we made the investment to double the size of our Canton manufacturing facility.

The expansion includes additional space in the manufacturing area which will also require additional staff to support the increasing demand on the facility. Breaking down the total budget of the expansion, over two-thirds was invested to improve the facility and the rest was used to purchase new equipment.

All these investments have been made to meet a growing demand we are seeing for post-sale services. Knowing the trend of the industry, the expansion will allow UNICOM Engineering to meet our growing demands and also provide additional capacity for future capital and equipment investments as we continue to grow. The facility improvements will not only help our manufacturing team, but will also benefit our customers by  allowing us to increase storage for customer owned materials. Additionally, customers will see benefits from our capital improvements as increased capacity for testing and pack-out operations which will reduce lead times.

With the new expansions, UNICOM Engineering is ready to serve your business, and expand business with our existing customers. If you are ready to find a global deployment and delivery partner, contact UNICOM Engineering at 800-977-1010 or sales@unicomengineering.com. To learn more, visit UNICOM Engineering.

 

 

Why is 12Gb SAS and 16Gb FC Storage Important for your System?

Why is 12Gb SAS and 16Gb FC Storage Important for your SystemWhen you think about your computer system, the chances are good that you aren’t thinking in terms of storage technologies like 12Gb/s SAS or 16Gb/s Fiber Channel (FC). You’re probably thinking about your operating system, or your software solution.  It has become a trend to rely on cloud-based data solutions, which leads to a lack of attention given to the system’s hardware.  Nonetheless, understanding your storage solutions is vital if you want to keep your hardware and software running at its peak potential.  Both of these new storage protocols will allow much better match to solid state drives and together can bring amazing performance for IO intensive solutions such as Big Data, data analysis, and high transactional solutions.

SAS storage is nothing new, and a SAS hard drive has long been understood as a reliable, efficient option.  What’s changed is the bandwidth:  12 GB/s SAS drives can improve performance and create new performance capabilities for your solution.  12Gb/s SAS is the third generation of the SAS protocol doubling its speed from the previous generation’s 6GB/s and carries over the ability to support SATA drives as well.

For many years, fiber channel (FC) has been the go-to interconnect technology, because it has excellent speed, performance, and extensive expandability and connectivity using Fiber Channel switches.  With a 12 GB/s SAS, you get performance somewhere between 8GB/sFC and 16GB/s FC, but for a far less prohibitive cost than 16GB/s FC. In other words, 12GB/s SAS doesn’t knock 16GB/s FC out of the running, but it does provide companies with a cost-effective alternative  especially for  direct attached soltuions.  Based on your solution’s needs, 16GB/s FC storage may be the best solution to maximize productivity, but 12GB/S SAS could be a viable alternative where a little less performance for a significant cost reduction could make  it easier to implement.  A common trend in storage environments is using tiered storage using SSD for high performance and  SAS drives for mid-tier performance, and finally large capacity  SATA  drives for bulk storage.   Both 16GB/s FC and 12GB/s SAS will allow seamless integration  of SSD solid state storage, rotational SAS drives, as well as SATA drives together to create an efficient, tiered storage environment.

It’s easy to get bogged down in technical details, like whether it’s better to have 12GB/s SAS or stick with Fiber Channel and go with 16GB/s FC. Rather than just trying to muddle through, it’s smart to join forces with a partner that can help you find the best hardware for your solution and integrate directly into your system. If you are looking for a partner to keep your business ahead of the crowd, no matter what your hardware requirements may be, contact UNICOM Engineering at 800-977-1010 or sales@unicomengineering.com. To learn more, visit UNICOM Engineering.